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Wafer packaging fab opens in Taiwan

Posted: 22 Nov 2011 ?? ?Print Version ?Bookmark and Share

Keywords:WLCSP? wafer bump? flip chip assembly?

STATS ChipPAC Ltd has recently inaugurated its 300mm wafer bump and wafer level chip scale packaging (WLCSP) facility in Taiwan. The $150 million-investment has allowed the company to increase production capacity of bumped wafers to 420,000 per year and WLCSP devices to 60,000 per year.

"The continued success and growth of our wafer bump, flip chip assembly and advanced wafer level chip scale packaging is a testament to our commitment to manufacturing excellence to drive form factor and performance requirements for our customers at advanced technology nodes and cater to the most demanding needs of mobile and consumer devices," noted Wan Choong Hoe, EVP and COO, STATS ChipPAC.

For WLCSP, all of the manufacturing process steps are performed in parallel at the silicon wafer level rather than sequentially on individual chips. The result is a package that is essentially the same size as the die, achieving one of the most compact semiconductor package footprints with increased functionality, improved thermal performance and finer pitch interconnection to the PCB, the company stated. STATS ChipPAC Taiwan's advanced wafer level process technologies include low cure temperature polymers and the use of copper for under bump metallization (UBM) and redistribution layers (RDL) to achieve higher densities and increased package reliabilities, added the company.

"The addition of fully integrated wafer level processing capabilities in our Hsin-chu Hsien facility increases our ability to provide customers with more cost-effective, high density wafer level packaging solutions for thin, lightweight, portable products. We have tripled our Class 100 cleanroom space to 3,478m2 or 37,437ft2 and significantly increased both our 300mm bump and WLCSP capacity. We have been working to expand our technology processes to support bump pitches down to 40?m," stated Richard Weng, managing director, STATS ChipPAC Taiwan.





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