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Silicide process offers 2 pretreatment types

Posted: 08 Dec 2011 ?? ?Print Version ?Bookmark and Share

Keywords:3D processing? silicidation? 3D cell?

Ulvac Inc. has claimed it has developed a new system to enhance its "ENTRONTM-EX W300" 300mm system series.

The newly-developed ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system offers CVD-Ni and CVD-Co processing for 3D devices. The system is well-suited to handle silicidation for such 3D cells. The system offers not only processing for silicide applications, but also handles other applications such as MEMS with Ni and Co films, so further expansion of the market can be expected in the future.

The company has developed processes for CVD-Ni and CVD-Co that feature 100 percent cover step coverage for the desired feature size and reduced (lower resistance) film impurity. The processes also include high throughput by utilizing CVD. They are also scalable for future processes and capable of dealing with thinning

According to Ulvac, its top priority when developing the CVD-Ni and CVD-Co processes was for enhanced performance in volume production. The company has developed a process with improved productivity, low COC and high throughput.

In the silicide process, pretreatment (an interface) is extremely important, and dry pretreatment is preferable as a damage-free pretreatment. ULVAC's new system offers the following two types of pretreatment:
??In-situ treatment: CDT (a single wafer chemical dry treatment) + CVD-Ni/CVD-Co
??Ex-situ treatment: RISE (a batch chemical dry pretreatment) + CVD-Ni/CVD-Co

With conventional methods, annealing for silicidation is normally carried out on a standalone system, but by incorporating an annealing module in the ENTRONTM-EX2 W300, the whole silicidation process can be performed on this one system.

The ENTRONTM-EX2 W300 has single and tandem type platforms, and with the tandem type, more complex processes (such as back-end processes) can be integrated for high system (process) scalability.

The system is highly scalable and has a wealth of options for maintaining and monitoring process stability, including a process data monitoring system (EDPMS), a non-contact radiation temperature monitor, and an ULVAC compact residual gas analysis monitor (Qulee).

The new "ENTRONTM-EX2 W300 CVD-Ni/CVD-Co" system will be available for sale on April 2012.

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