MEMS modules cut device size by 20%

STMicroelectronics N.V. (ST) has uncloaked an inertial module that combines three-axis sensing of linear and angular motion in a 3 x 5.5 x 1mm package. According to the company, the LSM330D shrinks devices by about 20 percent more than other devices. In addition, ST's iNEMO module with six degrees of freedom delivers advanced motion-sensing capabilities in space-constrained devices including smartphones, tablets and other portable electronic devices.

The iNEMO module enhances user experience and motion-sensing realism through its design and real-time sensor data fusion capabilities, stated ST. The design ensures precise alignment of the two sensors' reference axes and superior thermal and mechanical stability, while ST's iNEMO Engine data-fusion software uses sophisticated prediction and filtering algorithms to automatically correct measurement distortions and inaccuracies, explained the company.

The LSM330D multisensor module combines a user-selectable full-scale acceleration range from 2-16g with angular-rate detection from 250-2000dps along the pitch, roll and yaw axes. Addressing power constraints in battery-operated portable devices, the module includes power-down and sleep modes and two embedded FIFO memory blocks, one for each sensor, for smarter power management. In addition, it can operate with any supply voltage from 2.4-3.6V.

Fully software-compatible with ST's latest-generation three-axis digital accelerometers (LIS3DH) and gyroscopes (L3GD20), the iNEMO module makes it easy for customers using ST's single-function sensors to upgrade their designs, reducing the board size, number of external components and overall application system complexity, added ST.

The LSM330D is available in engineering samples. Unit pricing is $2.75 for volumes in the range of 1,000 pieces.