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GSA details 3D IC evolution

Posted: 23 Dec 2011 ?? ?Print Version ?Bookmark and Share

Keywords:EDA? 3D IC? 2.5D?

The Global Semiconductor Alliance (GSA) has released the report titled, "3D IC Architecture: A Natural Evolution." The report was sponsored by Macronix International Co., Ltd and Etron Technology. GSA also released the second edition of the "3D IC Design Tools and Services Tour Guide."

The 3D IC architecture report provides further insight on the current state of 3D and 2.5D technology such as the benefits of the technologies, the need to enhance the semiconductor ecosystem for 2.5D and 3D, barriers to adoption, likely early applications of 3D and 2.5D, and solutions that can help accelerate 3D technology rollout and market acceptance.

JEDEC to launch 3D IC standard
The standards developer is now set to release what it touts as the first 3D IC interface standard, which will be out in late December of this year or some time in January 2012. Read the full article here.

The Tour Guide, on the other hand, is a compilation of inputs from EDA, R&D, market research and services companies that have committed significant resources to developing 3D and 2.5D technology to accelerate market acceptance of this important paradigm shift. Readers of the Tour Guide are able to view the 3D IC capabilities of these companies.

According to Herb Reiter, GSA 3D IC working group chairman, "The working group put together these two documents because further shrinking of feature sizes will not be sufficient to continue the rapid pace of innovation that has fueled the growth of the semiconductor industry in the last 50 years. Utilizing the third dimension for IC design and manufacturing offers lower power dissipation, higher performance, reduced form factors and many other benefits."

"With every new technology, creative engineers and their management need to work together to make it cost-effective. GSA provides a forum for key players in this complex semiconductor ecosystem and recognizes the need to support design and manufacturing standards as well as new business practices�to accelerate 2.5D and 3D market adoption," said Jodi Shelton, president of GSA.

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