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Component assembly tool touts force control as low as 10g

Posted: 03 Jan 2012 ?? ?Print Version ?Bookmark and Share

Keywords:component assembly? semiconductor packaging? brushless DC?

Newport Corp. has rolled an assembly equipment that claims to offer advanced vision and fully automatic operation. The MRSI-605 Assembly Work Cell system is designed and configured for advanced packaging solutions required for semiconductor packaging, life and health sciences, aerospace, defense, automotive and communications applications. The company added that the product touts ultra-precise, high-speed component assembly.

The MRSI-605 uses an overhead solid granite platform that supports the placement head from above. This provides a large work envelope that is easily tailored for customer-configured systems. The major system axes use brushless DC linear servo motors with linear glass-scale encoder feedback for high speeds and accurate movements.

MRSI-605

The MRSI-605 Assembly Work Cell system is designed and configured for advanced packaging solutions.

The system's closed-loop force control of die placements enables placing delicate Gallium Arsenide (GaAs) die with as little as 10g of force. Using programmable higher forces, the system is also capable of eutectic bonding with complete scrub and temperature control. For applications such as these, die are picked from waffle pack, Gel-Pak, wafer, and tape and reel. The MRSI-605 is also configurable with epoxy dispense pumps and epoxy stamping for a complete assembly solution.

The MRSI-605 operates on Newport's Windows work cell software. This software operates all Newport Advanced Packaging Assembly and Dispense systems and provides excellent process control and extensive interchangeability with other Newport Advanced Packaging equipment.





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