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STATS ChipPAC builds new factory

Posted: 16 Jan 2012 ?? ?Print Version ?Bookmark and Share

Keywords:manufacturing? advanced packaging? semiconductor test?

STATS ChipPAC Ltd has held a groundbreaking ceremony for its new Singapore factory. The facility will be 197,000 square feet and is located next to STATS ChipPAC's current factory in Yishun, Singapore.

The new factory will enable the company to expand its manufacturing capabilities for advanced wafer level technologies including embedded wafer level ball grid array (eWLB), wafer level chip scale packaging (WLCSP), integrated passive devices (IPD) and through silicon via (TSV).

STATS ChipPAC invested approximately $250 million in Singapore over the last three years to expand its technology offering and manufacturing capacity. The new factory will allow the company to further expand its capacity in advanced wafer level packaging and test solutions to support growing customer demand. The Company expects to invest an additional $220 million in Singapore over the next several years.

Wafer level packaging has been one of the highest growth segments in the semiconductor industry with demand that has outpaced the available market capacity. STATS ChipPAC's significant focus on the development of wafer level technologies has resulted in a broader range of advanced process capabilities and package architectures for high performance mobile and consumer applications.

"The new factory in Singapore will greatly contribute to our company's overall strategic growth initiatives. Our larger presence in Singapore is an important step in enabling us to further optimize our overall manufacturing activities by concentrating on advanced packaging capacity that will generate more cost, productivity and efficiency advantages. The combination of excellent infrastructure and semiconductor ecosystem in Singapore and our depth of technical knowledge and advanced packaging production volume experience will enable our operation in Singapore to thrive in the globally competitive outsourced semiconductor assembly and test (OSAT) industry," said Lew Hon Sang, managing director, STATS ChipPAC Singapore. "In 2010, we celebrated the grand opening of our new 300mm eWLB manufacturing in Singapore. Today's groundbreaking is another major milestone for STATS ChipPAC Singapore."

Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet). The new facility is expected to be operational by the fourth quarter of 2012.





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