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Mask alignment system boasts throughput up to 220 wafers/h

Posted: 09 Feb 2012 ?? ?Print Version ?Bookmark and Share

Keywords:mask alignment system? high-brightness LED? UV light?

EV Group (EVG) has unleashed an automated mask alignment system that according to the company optimizes the fabrication of high-brightness (HB) LEDs, compound semiconductors and power electronics.�The EVG620HBL boasts a high-intensity UV light source and five cassette stations to enable continuous manufacture of devices.

The device claims to delivers throughput of up to 165 six-inch wafers per hour (up to 220 wafers per hour in first print mode). The company said that its device is in line with the expanding market of solid-state and general lighting applications, as well as signage, professional displays and stationary (non-vehicle) signals.

EVG620HBL

EVG620HBL touts fast HB-LED manufacture.

The company said it created the EVG620HBL aligner in response to customer demand for a mask alignment system dedicated to meeting increasing device yield and throughput requirements.

A key feature of the EVG620HBL is the availability of special recipe-controlled microscopes whose illumination spectrum is optimized to ensure the best pattern contrast with various wafer and layer materials. These include advanced substrate materials such as sapphire, silicon carbide (SiC), aluminum nitride (AlN), metal and ceramic.

The EVG620HBL is available for purchase.





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