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130nm CMOS logic backend tech unleashed

Posted: 26 Mar 2012 ?? ?Print Version ?Bookmark and Share

Keywords:CMOS logic? 130nm? aluminum metallization?

SilTerra Malaysia Sdn Bhd, a Malaysian-based wafer foundry, has uncloaked the CL130AL, a 130nm CMOS logic technology with aluminum backend interconnection. The technology is geared for mainstream, high volume consumer electronics applications including touch controller, flash memory card controller, USB pen-drive controller, card reader, host MP3 and others, stated the company.

The technology offers single poly up to six layers of aluminum metallization, borderless contacts and via with USG inter-metal dielectric. In addition, the CL130AL claims to offer significant device performance advantages and more gross dies in a wafer compared with foundry standard 180nm CMOS logic technology.

SilTerra is partnering with ARM to license ARM Artisan physical IP design libraries, including standard cells and memory compilers.

The CL130AL is available for prototyping and the design flows have been validated in Synopsys and Mentor platforms.





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