TI expands IC packaging options with bare die
Keywords:packaging solution? multichip module? space-constrained?
TI noted that the integrated packaging solutions provide both weight and power dissipation savings, while improving overall system-level reliability in space-constrained applications. Bare die options are available for specific devices in TI's analog, power management, DSP and MCU products. Bare die target applications include consumer smart cards, mobile RFID readers, medical, industrial, and security devices.
The bare die enables integration of electronics into smaller form factors and allows integrating components such as amplifiers, data converters and power components into one substrate. Additionally, customers can take advantage of the small quantity options to get their products to market faster, added TI.
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