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TI expands IC packaging options with bare die

Posted: 02 Apr 2012 ?? ?Print Version ?Bookmark and Share

Keywords:packaging solution? multichip module? space-constrained?

Texas Instruments Inc. (TI) has extended semiconductor package options with the availability of bare die that according to the company allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes. The company said the bare die options provide the capability to integrate multiple functions into smaller areas, enabling customers to design end equipment with smaller form factors by implementing multichip modules (MCM) or systems-in-package (SiPs).

TI noted that the integrated packaging solutions provide both weight and power dissipation savings, while improving overall system-level reliability in space-constrained applications. Bare die options are available for specific devices in TI's analog, power management, DSP and MCU products. Bare die target applications include consumer smart cards, mobile RFID readers, medical, industrial, and security devices.

The bare die enables integration of electronics into smaller form factors and allows integrating components such as amplifiers, data converters and power components into one substrate. Additionally, customers can take advantage of the small quantity options to get their products to market faster, added TI.





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