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OpenET group reveals pioneering members, updates interface spec

Posted: 17 Apr 2012 ?? ?Print Version ?Bookmark and Share

Keywords:envelop tracking? RF front-ends? interface specification?

An industry association that promotes energy efficient wireless transmission through envelope tracking (ET) has revealed its first batch of members. OpenET Alliance membership includes Altair Semiconductor, Anadigics Inc., Huawei Technologies Co. Ltd, Maxim Integrated Products, Nujira Ltd, Sony Corp. and theUniversity of Florence.

Traditional RF front ends have become increasingly inefficient as more data is packed into the radio spectrum through standards such as 3G, 4G and digital TV. Envelope Tracking is the most effective wide-band power optimization technology for the RF front end of 3G and 4G handsets.

Originally developed in the 1930s, ET is now increasingly seen as the only viable solution for energy efficient, broadband 3G and 4G products, the company said. For consumers it promises smartphones that will last far longer on a single charge, and can support multiple frequency bands for global roaming, OpenET explained. For network operators and broadcasters it offers the potential of a 66 percent reduction in transmitter-site energy costs, the alliance added.

"It is significant that our membership is drawn from right across the supplier ecosystem, embracing chipset platform, PA and modulator vendors, OEMs and academic institutions. No one supplier has all the answers, so this kind of industry collaboration is key to effective development in the sector," said Steven Baker, technical director of the OpenET Alliance.

The alliance has also released to its OpenET members an updated interface specification for terminals. This includes recommended system noise specifications to support full bandwidth LTE signals.

Aside from the new ET interface specifications, the OpenET Alliance, through its systems working group, is also developing a common system simulation model to ensure that all participants share a deep understanding of system issues that underpin specification and design choices. The company expects that this will lead to the earliest delivery of effective components and products.

The group is planning additional specification development this year that will focus on "medium power" pico- and femto-infrastructure, public safety and military applications.





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