Microsemi extends military temp IC devices

Microsemi Corp. has rolled out its SmartFusion customizable system-on-chip (cSoC) devices that according to the company meet the strict military operating temperatures ranging from -55°C to 125°C. The devices feature integrated ARM Cortex-M3-based processors and are aimed at applications that include avionics systems and missiles, as well as unmanned and weaponry systems.

SmartFusion cSoCs provide military and avionics systems designers with a reprogrammable, non-volatile logic integration solution, noted Microsemi. The devices are based on secure flash technology that provides immunity against damaging radiation-induced configuration upsets, while eliminating the need for additional code storage. The easily reprogrammable cSoCs also enable quick prototyping and design validation capabilities that streamline product development efforts.

Additionally, the SmartFusion claims to deliver immediate processing to support short initiation systems without the need for additional power circuitry. Offered in 500K and 60K equivalent gates and support up to 204 IOs, the devices enable system and power management capabilities where multiple power rails exist. The company also said the cSoCs allow designers to combine analog and digital components, saving board space.

Military temperature samples and software will be available in May for prototyping purposes. Fully qualified parts will be available June. Qualified parts will include the SmartFusion A2F500 FG/G: 484 and 256 packages as well as the A2F060 FG/G 256 package.