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ST's diplexer improves smartphone GPS

Posted: 18 Apr 2012 ?? ?Print Version ?Bookmark and Share

Keywords:GPS? diplexer? antenna-sharing IC? smartphone?

STMicroelectronics N.V. has announced what it believes is a highly miniaturized IC for 4G smartphones that enables high GPS performance. The company also revealed that it used its advanced packaging expertise to create a 1.14mm2 antenna-sharing IC capable of delivering high signal strength to several RF receivers simultaneously.

Users of smartphones featuring the DIP1524 will experience advantages including faster GPS startup time (time to first fix) and more accurate position detection, stated ST. As a result, even more reliable location-based services that benefit from strong connections to several satellites, added the company.


The DIP1524 enables GPS/GLONASS, Bluetooth, WiFi and LTE in smartphones.

The DIP1524 diplexer uses ST's Integrated Passive Device (IPD) technology, fabricated on a glass substrate that minimizes insertion losses compared to the ceramic substrates used by other manufacturers, claimed ST. Its flip-chip package has a footprint the same size as the chip itself, thereby occupying 65 percent less PCB area than competing devices in conventional packages with a total footprint larger than 3mm2. The DIP1524 enables handset designers to connect receivers for GPS/GLONASS satellites, Bluetooth, WiFi and LTE band 7 to the same antenna.

The antenna-sharing IC features GPS insertion loss of 0.65dB (max.), GLONASS insertion loss of 0.75dB (max.), zero performance drift, high channel isolation and boasts no value dispersion between components.

The DIP1524-01D3 is sampling in a 4-bump flip-chip package, and will be available in high volumes priced from $0.129 for orders of more than 1000 pieces. Alternative higher-volume pricing options are available on request.

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