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Sensor cuts PCB out of automotive sensing modules

Posted: 30 May 2012 ?? ?Print Version ?Bookmark and Share

Keywords:position sensor? ESD? EMC requirements?

Melexis Microelectronic Integrated Systems NV has announced the MLX90364 Triaxis linear and angular position sensor. The device, based on dual mold package construction, cuts the need for a PCB within a sensing module. It integrates a 12bit resolution position sensing die and the decoupling capacitors needed to meet the ESD and EMC requirements of automotive environments.

The dual mold package can be welded or soldered directly to a rugged connector or termination and further potted or over-molded. Dedicated ears allow greater accuracy levels to be realized when mounting.

The sensor device can be used in linear and rotary position sensing applications. It features fully programmable transfer functionality, selectable analog and PWM output modes, open/short diagnostics, on-board diagnostics, undervoltage detection and overvoltage protection.

The MLX90364 is qualified according to the AEC-Q100 and Q200 automotive standards, and a SENT-SAE J2716 capable version is under development.

It has passed robustness validation tests, such as long exposures to ambient temperatures up to 170C.

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