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ST's Baraton discusses green manufacturing efforts

Posted: 19 Jun 2012 ?? ?Print Version ?Bookmark and Share

Keywords:lead? semiconductor manufacturing? environment? energy consumption? PSECE 2012?

STMicroelectronics has started a campaign this year to communicate its new "Life Augmented" brand promise. "It means that it is not only getting more technology but getting technology to better serve in whatever we give everybody in life... making our customers, even our employees more inspired by this promise," according to Xavier Baraton, group VP, packaging & test manufacturing, ST Microelectronics.

At the PSECE 2012 show, ST stressed that the semiconductor industry needed to expand its focus from two P'sprice and performanceto include a third "P": power consumption. Giving statistics on increasing demand for power, Baraton claimed that the semiconductor industry can play a major role in addressing the energy crisisas semiconductors are the upstream "source" technology, if they are green, everything downstream can be green.

energy scenario

Figure 1: Electrical energy consumption will grow from 20,300TWh to 30,000TWh by 2030, according to statistics presented ST at the show (chart above from Baraton's presentation).

In an interview with EE Times Asia's Vivek Nanda, Baraton further discussed STMicroelectronics' efforts to reduce the environmental impact of semiconductor manufacturing.

EE Times Asia: Do you do total life cycle assessment on your products?
Baraton: Yes, we do. There were some papers done by our environment department trying to understand the environmental impact of all our devices from the beginning to the end. We have been the leader in the field of lead-free manufacturingwe have banned almost all the lead from our manufacturing starting from BGA [ball-grid array]. I can tell you that because back in 2004 or 2005 I was the worldwide task force leader for ST to get away from lead in our BGA packages in our solder balls.

When you remove lead from the balls and the leads, you make interconnections more fragile, especially in a drop test. When you drop your phone, the BGA packages that are more fragile are subject to cracks in the solders. So we have formed some new methodologies with some doping with special alloys, like nickel, in order to be more robust but green.

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