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NEC, Advantest team up to develop RFID test sol'n

Posted: 21 Jun 2012 ?? ?Print Version ?Bookmark and Share

Keywords:RFID IC? parallel test? anti-crosstalk interface?

Shanghai Hua Hong NEC Electronics Co Ltd (Hua Hong NEC) and Advantest Corp. have collaborated to develop a wafer-level, multi-site parallel test solution for radio-frequency identification (RFID) semiconductor devices that meet industry-standard ISO 14443 guidelines. This new test methodology is currently used to improve the cost efficiency of volume-production testing at Hua Hong NEC.

By combining Hua Hong NEC's production processing and test development capabilities in smart card and information security applications with Advantest's T2000 test platform, the jointly developed test solution aims to provide fast accurate recognition and feedback for both cost-effective testing current and future generations of RFID devices.

RFID devices that are ISO 14443 compliant divide into two types: Type A and Type B.�The major difference between them is in the modulation/demodulation for the 13.56MHz carrier wave.�When in use, a proximity coupling device (PCD) sends a carrier signal at 13.56MHz to the RFID device.�The RFID device's antenna receives the signal wave, which carries both transmitted data and the power that drives the RFID device.�The RFID device then sends a return signal carrying response data back to the PCD.�In this way, information is communicated between the PCD and the RFID.�However, crosstalk among RFID devices during wafer-level testing can result in reduced production yields and low productivity.

The new test solution uses an anti-crosstalk interface and an optimized algorithm within the test program to minimize the bit error rate and perform multi-site parallel testing.�This methodology is currently being used in mass production to test 32 RFID sites in parallel.�The next-generation solution being co-developed will be capable of 64-site parallelism to meet the testing needs for future RFID devices.





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