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Switch IC improves audio headset experience

Posted: 25 Jun 2012 ?? ?Print Version ?Bookmark and Share

Keywords:audio headset detection? audio switch? TS3A225E?

Texas Instruments Inc. has debuted the TS3A225E audio headset detection and configuration switch IC that is designed to enable universal headset support for audio applications in a single chip. The chip integrates automatic detection and switching function in a single device, cutting detection, leakage and click-pop issues in smartphones, tablets, laptops, audio docks and home audio applications that are caused by using discrete components.

The TS3A225E extends the functionality of the company's TLV320AIC3262 and TLV320AIC3212 audio codecs. And, for designers who need a 2x2 crosspoint switch functionality without headset-type detection, TI offers the reduced-cost TS3A26746E.


The TS3A225E audio headset detection and configuration switch IC integrates the automatic detection and switching function in a single device.

The TS3A225E supports three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers. It eases system design because it detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2x2 crosspoint switch. It also gives users more control over system operation and debug by reporting headset information over I2C interface.

The device also prevents audio signal distortion, offering 66 percent lower on-resistance (100m) for the ground switch compared to the competition.

For easier mounting and routing in the system, the TS3A225E is available in both 16-pin QFN and WCSP packages. Suggested retail pricing is $0.32 in 1,000-unit quantities.

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