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Smart packaging electronics to be available by 2014

Posted: 16 Jul 2012 ?? ?Print Version ?Bookmark and Share

Keywords:flexible packaging? printed electronics? time-temperature sensor?

Bemis Company Inc., a producer of films and packaging for food and healthcare industries, has worked with Thin Film Electronics to develop a flexible sensing film which can wirelessly communicate information.

The agreement between the two companies aims to work on a time-temperature sensor that can be used to monitor perishable goods and pharmaceuticals. With a targeted commercial availability of 2014, the packaging will be able to collect and wirelessly communicate sensor information for use by food, consumer products and healthcare companies.

The joint venture between the two companies hopes to create a technology that would eventually make printed electronics a component of every package that is manufactured.

The flexible packaging market in North America is estimated to be worth $18.3 billion annually.


Mock-up of RF sensor and tag for monitoring and reporting food freshness.
Source: Thin Film Electronics

- Peter Clarke
??E.E. Time U.S.

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