Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Laird to attend symposium on Electromagnetic Capability

Posted: 19 Jul 2012 ?? ?Print Version ?Bookmark and Share

Keywords:EMC field? elastomers? EcoShear? ReMovl? board-level shielding solutions?

Laird Technologies Inc. has announced that it will be attending the 2012 IEEE International Symposium on Electromagnetic Capability. The event is scheduled to take place at the David L. Lawrence Convention Center in Pittsburgh, Pennsylvania, August 5-10. Laird Technologies will be located at booth #822.

The company plans to exhibit a number of EMI solutions that address changing issues in the EMC field, such as high cycling, packing densities and environmental treads. The company plans to showcase its elastomers and Fabri-over-Foam solutions including EcoShear and hybrid tape products. The company will also showcase new board-level shielding solutions, such as its ReMovl? product enhancement and the Rigid Corner Board Level Shield Enhancement.

The 2012 IEEE International Symposium on Electromagnetic Capability is sponsored by the IEEE Electromagnetic Compatibility Society. The program features technical sessions, tutorials and networking events as well as an exhibit hall with hundreds of booths featuring the latest products and services in the EMC field.

Article Comments - Laird to attend symposium on Electro...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top