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Intel's RF solution enables lower-cost 3G designs

Posted: 31 Jul 2012 ?? ?Print Version ?Bookmark and Share

Keywords:RF solution? 3G designs? machine-to-machine? Internet of Things?

SMARTi UE2p, a radio frequency solution from Intel Corporation, integrates 3G power amplifiers into radio frequency circuits. The new system-on-chip (SoC) solution enables a smaller footprint and reduces complexity for developers.

The SMARTi UE2p simplifies product development and supply chain logistics with the reduction in component count and system complexity. This will allow the introduction of lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the "Internet of Things."

The SMARTi UE2p integrates Intel's 3G High Speed Packet Access (HSPA) radio frequency transceiver SMARTi UE2 and 3G power amplifiers on a single 65nm silicon die. The integration of power management and sensors allows direct connection to the device battery. The SMARTi UE2p supports multiple 3G dual band configurations for global operation with the Intel XMM62xx HSPA slim modem family.

This solution is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules. Samples will be provided to select customers beginning in the fourth quarter of 2012.

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