Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

UMC first in producing FinFET process technology

Posted: 01 Aug 2012 ?? ?Print Version ?Bookmark and Share

Keywords:UMC? TSMC? FinFET?

Taiwan's United Microelectronics Corp. (UMC), which has always placed second to foundry leader Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), is seen to be at an advantage by being first in production with FinFET process technology.

Despite TSMC being one of the FinFET idea originators from over a decade ago, UMC, with the help of a licensing deal with IBM, could be in production with a 20-nm FinFET process by 2H14.

UMC has licensed a process for FinFETs on bulk silicon rather than on silicon-on-insulator wafers. This allows easier introduction after running a 20-nm bulk CMOS process. Ensuring fins are well defined with a rectangular cross section can improve performance and making FinFETS on SOI wafers could produce a further improvement in leakage current performance.

UMC, through CEO Shih-Wei Sun, did not rebut statements thrown at him about the company's 2014 target for the introduction of 20-nm FinFETs.

It was also noted that UMC's first FinFET would be based on the same 20-nm back-end process as a 20-nm planar CMOS. Sun said that most companies were already doing this but some were defining it as a 16- or 14-nm process.

Meanwhile, TSMC's first FinFET process will be at 16-nm and is expected to be in production by 2H15.

- Peter Clarke
??EE Times





Article Comments - UMC first in producing FinFET proces...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top