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Manufacturing/Packaging??

Nikon, Intel to develop 450mm wafer steppers

Posted: 09 Aug 2012 ?? ?Print Version ?Bookmark and Share

Keywords:Nikon? Intel? 450mm wafer? EUV? ASML?

According to a Japanese newspaper, Nikon Corp. is set to work with Intel Corp. to develop the next generation semiconductor manufacturing equipment capable of handling 450mm wafers. The report added that Nikon plans to commercialize it by 2018.

How much financial support Intel will provide to Nikon is unclear. The Japanese newspaper reported that Intel "has apparently decided to shoulder tens of billions of yen in development costs for Nikon."

Chuck Mulloy, a spokesperson for Intel, said the company is not commenting on the Nikkei report at this time.

Earlier in July, Intel agreed to acquire a 15 percent stake in ASML Holding NV as part of a $4.1 billion deal to accelerate the development of extreme ultraviolet (EUV) lithography and technology needed for the looming transition to 450mm wafers.

The $4.1 billion includes about $2.1 billion in equity investment in ASML, good for 10 percent of ASML's shares, Intel said. The company said it also committed to buy another five percent of ASML's shares for about $1 billion in the relatively near future.

Earlier this week, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) announced it would take a five percent stake in ASML as part of a similar arrangement.

- Junko Yoshida
??EE Times





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