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Global tech alliance focuses on glass, LED, wafer singulation

Posted: 04 Sep 2012 ?? ?Print Version ?Bookmark and Share

Keywords:wafer singulation? technology alliance? LED?

A technology alliance has been recently formed that aims to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by Portland-based, FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH. According to the companies, the turnkey system designed for�glass, sapphire and brittle materials cutting will be available exclusively through InnoLas' worldwide sales network.

Conventional laser cutting is based on rapid heating leading to vaporization and material removal. This process is not only slow, but it also leads to unwanted micro cracks and a rough surface finish. Material cut with conventional laser processes require post-processing in order to remove the unwanted damage. These subsequent grinding and polishing steps are costly and time consuming.

Filament cutting, on the other hand, uses ultra-short laser pulses in the picosecond range that cut brittle materials via plasma dissociation. This new process ensures lower surface roughness, high bend strength, and faster processing speed. This new laser cutting technology works especially well on chemically strengthened (Gorilla, etc.) glass and sapphire, which have been difficult to cut with conventional methods. Filament cutting thus enables a higher quality, throughput and yield in the production of touchscreen displays for smartphones and tablets. Further areas of application include Si, SiC, and GaAs at very high speeds.

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