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A*STAR, Hitachi Chemical team up on 3D IC packaging tech

Posted: 17 Sep 2012 ?? ?Print Version ?Bookmark and Share

Keywords:3D IC packaging? mobile handsets? computers? gaming platforms?

A*STAR's Institute of Microelectronics, and Hitachi Chemical Co., Ltd. have announced their collaboration on a joint research of high performance material technologies to support thin wafer processing for 3D IC packaging.

Through this research collaboration, Hitachi Chemical hopes to leverage IME's advanced 3D IC process capabilities to enhance material technologies that can support the demanding requirements of thin wafer processing and enable the industry to move to high-volume production of 3D ICs. This innovative research aims to improve productivity of 3D ICs, which will be used in mobile handsets, computers, gaming platforms, wireless and wired communication equipment, cameras, automobiles and aerospace applications.

Prof. Dim-Lee Kwong, executive director of IME, stated that their expertise, experience and infrastructure in 2.5D/3D IC process-integration, thin-wafer-handling and assembly flow provide a compelling value proposition for advanced material manufaturers to test their products and overcome key technical barriers in the commercialization of the technology.

Shun-ichiro Uchimura, Vice President and CTO of Hitachi Chemical, also stated that IME has strong background technologies of microelectronics, especially in IC packaging technologies. He added that the joint research between IME and Hitachi Chemical will contribute greatly to the progress in advanced 3D IC packaging technologies.

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