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QFN package design kit for ADS launched by STATS ChipPAC

Posted: 17 Sep 2012 ?? ?Print Version ?Bookmark and Share

Keywords:Quad Flat No-Lead? Advanced Design System? design automation? software for radio frequency?

STATS ChipPAC Ltd. has announced the launch of its Quad Flat No-Lead (QFN) package design kit for Agilent Technologies' Advanced Design System (ADS).

The QFN package design kit (PDK) enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation (EDA) software for radio frequency (RF), microwave and high-speed digital applications for RF semiconductors.

Dr. Han Byung Joon, chief technology officer of STATS ChipPAC, stated that as RF devices become more compact with increasing design complexities and the integration of multiple integrated circuit (IC) technologies, the accuracy and cycle time required for package modeling and simulation become a critical factor in time-to-market and overall cost. By utilizing the QFN PDK with Agilent's ADS software, our customers will be able to perform fast, accurate simulation in different circuit layout scenarios to achieve first-pass design success. This is increasingly important as RF ICs continue to shrink in dimension and operate at higher frequencies.

"ADS enables IC designers to identify and resolve complex integration issues early in the design process, before the fabrication of wireless components like power amplifiers and RF front-end modules," said Joe Civello, ADS Product Manager for Agilent EEsof EDA. "The combination of STATS ChipPAC's QFN package design kit and our ADS software will provide customers with the information they need to quickly make design decisions to position their RF devices for a successful production ramp."

STATS ChipPAC's package design kit contains models for 3x3, 4x4, 5x5, 6x6, and 7x7 QFN package sizes and was developed for use with ADS 2009 Update 1 and ADS 2011 software in both Windows and Linux versions.





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