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Thermal lock-in analysis drives 3D package dev't

Posted: 29 Nov 2012 ?? ?Print Version ?Bookmark and Share

Keywords:DCG Systems? 3D IC? ELITE thermal lock-in analysis system?

DCG Systems Inc. has announced that a leading memory supplier from Korea has accepted delivery of ELITE thermal lock-in analysis system. According to the company, the solution offers the ability to localise electrical faults within a 3D packaged device with the highest sensitivity and accuracy.

"After thorough technical evaluation, we have determined ELITE is the technology that can help us accelerate the development of advanced 3D packaging technology," indicated a senior engineer of the package R&D group from the said firm.

"This world-class supplier will be the third major memory customer in Asia who has adopted ELITE as their strategic solution for the advanced 3D package development," said Randy Schussler, GM of IRIS business unit, DCG Systems. "They expressed confidence in DCG after side-by-side technical evaluation of the ELITE system. 3D IC is a fast growing market segment of the semiconductor industry. We are delighted to provide a development solution for their leading-edge 3D memory devices."

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