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Imec, Altera expand scope of patterning research

Posted: 21 Dec 2012 ?? ?Print Version ?Bookmark and Share

Keywords:3D? CMOS? FinFET? FPGA?

Building on the framework of its Insite program, Imec will broaden its collaboration with Altera in evaluating 3D process technologies for use in FPGA products. The joint research will now evaluate the readiness and limits of 14/10nm CMOS, FinFET and new interconnect technology options.

Imec's Insite program provides the design community in fabless, fablite and IDM companies with technology data that can be used for early assessment of the impact of these technologies on product roadmaps and the potential for future products. The combined impact of technology, circuit design and system-level architecture options on power, performance and area are evaluated and a cost assessment is provided.

The program also allows for product roadmap steering, early feedback towards technology specification, early decisions on required architectural design changes and faster learning cycles for technology adoption with reduced risks.

"As FPGAs continue to evolve as a result of silicon convergence, it is imperative our devices leverage the latest, most advanced technologies," said Misha Burich, senior vice president and chief technology officer at Altera.

Separately, Imec unveiled earlier this month a prototype of a spherical LCD display that can be embedded to produce fully pixelated contact lenses. (See Curved LCD display key to pixelated contact lens.) The nanoelectronics research firm also rolled out last week during the International Electron Devices Meeting a device which it claims could enable the development of thin-film passive UHF RFID tags to replace item-level bar codes. (See Imec advances UHF Schottky diode, 10nm FinFETs.)





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