SMIC boasts BSI image sensor tech

Semiconductor Manufacturing International Corp. (SMIC) has uncloaked its backside-illuminated (BSI) CMOS image sensor (CIS) technology with the first test chip showing good image quality even in low-light conditions. The company added that the complete BSI process technology is aimed at the market for high-end mobile phone cameras, and will enter risk production with partnering customers next year.

SMIC's BSI process development is geared for customers with 5MP and higher resolution phone cameras and high-performance video camera products. BSI sensors are more light-sensitive than frontside-illuminated CMOS sensors, allowing today's top smartphones to take brighter, clearer pictures at night or indoors, noted the company. While driving its BSI technology towards commercial production, the company is soon to begin early development of next-generation CIS technology based on 3D integrated circuits.

"We are proud to be the first Chinese foundry to successfully develop BSI CMOS image sensors," expressed SMIC CEO, TY Chiu. "CMOS image sensors are among the key value-added technologies that SMIC offers for customers in the mobile device and imaging markets."