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Thick plated copper process for monolithic PMIC apps

Posted: 17 Jan 2013 ?? ?Print Version ?Bookmark and Share

Keywords:power management? PMIC? thick plated copper? TPC process?

United Microelectronics Corp. (UMC) has unveiled a thick plated copper (TPC) process for power management IC (PMIC) applications. The TPC solution, developed with Taiwan-based packaging house Chipbond Technology Corp., offers thick plated copper layers to achieve higher current flow and better thermal dissipation, reducing chip resistance by 20 per cent or more compared with conventional Aluminium top metal, said the company.

Promising to increase power conversion efficiency and extend battery life, the integrated converter also requires fewer and smaller passive components for the power system. This results in smaller size PCBs that make the application ideal for slim profile mobile power management products such as smartphones, tablets and ultrabooks, added the company.

The TPC solution is now ready for UMC 8in BCD (Bipolar/CMOS/DMOS) processes including 0.35um, 0.25um and 0.18um nodes, with 0.11um available in the coming months. Validated design rules will be provided to customers by UMC and Chipbond, with qualification reports available upon request.

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