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Qualcomm, Imec team up on CMOS advancement

Posted: 30 Jan 2013 ?? ?Print Version ?Bookmark and Share

Keywords:CMOS? 3D stacking? R&D?

Imec and Qualcomm Technologies Inc. have extended their collaboration agreement to speed up scaling technologies for logic and memory devices. According to the terms of the deal, Qualcomm Technologies will gain comprehensive insight into all advanced process technologies under investigation at Imec to help shape future product roadmaps.

"We have collaborated with Imec on the 3D stacking program for the last four years and we look forward to expanding our engagement with Imec to include CMOS research and the new MRAM program. Early engagement on new microelectronic technologies with Imec enables Qualcomm to deepen the co-optimisation of product architecture and technology while mitigating new technology risk in collaboration with our supply partners," Jim Thompson, engineering EVP at Qualcomm Technologies said.

Imec offers R&D program members comprehensive insight into future IC technologies that aren't widely available to the industry yet. This enables participating fabless and fablite organisations to stay at the forefront of next-generation semiconductor manufacturing and design. Program members are able to provide early feedback towards technology specification, make timely architectural design changes, and adopt new technology faster with reduced risks.

"Strong collaboration between foundries, IDMs, fabless and fablite companies, packaging and assembly companies, and equipment and material suppliers at Imec play a critical role in pushing forward the development of innovative solutions," stated Luc Van den hove, president and CEO at Imec. "A true win-win situation, we are confident our new broadened collaboration agreement with Qualcomm will continue to pay dividends in the future."





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