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LED array plastic interconnection tech unveiled

Posted: 01 Feb 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Molex? LED array holder? Bridgelux? Pico-EZmate? Vero?

Molex Inc. has developed a LED array holder technology touting integral electrical, mechanical and optical connectivity for optimal performance and to simplify design integration for lighting manufacturers. According to the company, the technology transfers the connectivity and ease of use features from the LED array metal or ceramic substrate to a separate plastic body substrate, enhancing thermal, optical and mechanical interconnect functionality. The plastic body substrate can be combined with the LED array package in a number of ways to provide an array top side surface with multiple connection choices, added Molex.

The technology, which was co-developed with Bridgelux Inc., has been incorporated into the Vero array product family from Bridgelux. The interconnect technology is expected to make future LED array products easier to integrate and more cost effective, enabling lighting OEM's to reduce system costs, decrease time to market and to improve the reliability of LED luminaires they design. These advances include thermally isolated solder pads, an integral Molex Pico-EZmate header, and improved mechanical attach and optical reference features, all while maintaining a very low profile. The solder pads are designed to make direct soldering easier and more robust than soldering to current array packages made of materials such as aluminium or ceramics. The Pico-EZmate connector header option enables a solder free electrical interface and options for field service and replacement.

The plastic body, interconnect technology builds on technology from Molex that is used in consumer electronics and other high volume markets. Molex will offer a range of UL approved Pico-EZmate mating harness products for a robust interconnection system that is easy and cost-efficient to implement with the entire Vero product range.

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