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Infineon unveils power ICs on 300mm thin wafers

Posted: 21 Feb 2013 ?? ?Print Version ?Bookmark and Share

Keywords:300mm thin-wafer? CoolMOS? power semiconductor?

Infineon Technologies has announced what it says is a major breakthrough in the manufacturing of power semiconductors on 300mm thin wafers. In February, the company received the first customer orders for products of the CoolMOS family produced by the 300mm line at the Villach (Austria) site.

Infineon claims to be the first and only company to produce power semiconductors on 300mm thin wafers. As a result of their larger diameter compared to standard 200mm wafers, two-and-a-half times as many chips can be made from each one. Customers benefit from the new technology, from the ready availability, enhanced capacity and improved productivity. Power semiconductors from Infineon feature low energy loss and compact design. Although not much thicker than a sheet of paper, the chips have electrically active structures on the front and back. Thin-wafer technology is the basis for this.

The next step is for the present manufacturing concept for CoolMOS products, qualified from start to finish, with the front-end site Villach and assembly of the thin chips at the back-end site Malacca (Malaysia), to be expanded to the front-end site Dresden. Here the focus is on high-volume production in a fully automated 300mm line. The basis for the processes required and the manufacturing technology is currently being developed in research projects in Dresden. The technology transfer to Dresden is running on schedule and qualification of the first CoolMOS products will be completed in March. Shortly, in Villach more power semiconductor technologies will be transferred to the 300mm line and produced. The development of the next power technology generation will focus on 300 instead of 200mm technology.

Last year, for the ninth time in a row, the independent research institute IMS Research (an IHS company) confirmed Infineon's market leadership in power semiconductors. These are primarily used where energy must be efficiently controlled, transmitted or transformedfor example, in servers, PCs and notebooks, in entertainment electronics and mobile telephone infrastructure, in lighting systems and wind-power and photovoltaic systems.

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