Globalfoundries, ASML to deliver 28nm, 20nm tape-outs

Brion Technologies, a division of ASML, has teamed up with Globalfoundries to deliver high volume computational lithography capabilities for 28nm and 20nm tape-outs. The firms are also in track to speed up the development of future nodes including extreme ultraviolet (EUV) lithography.

The process window is very challenging for leading edge technologies and substantially impacts yield, time to market and ultimately profitability. ASML's holistic lithography approach enables both process window enhancement and process window control from design to mask tape-out to chip manufacturing by leveraging the computational model accuracy that comes from tight integration with the ASML scanners including FlexRay and FlexWave.

Globalfoundries is working with Brion to ensure that their foundry customers have the best possible and most cost effective semiconductor manufacturing capability available. Critical to achieving this is the use of Tachyon Flex, which is the platform architecture that allows the Tachyon applications to run on a customer's existing compute cluster, distributed across many thousands of CPU cores. Tachyon Flex has been demonstrated to have efficiency (or scalability) significantly better than other industry competitors, resulting in substantial time and cost savings for large tape-outs.