Connector supports 40Gb/s per differential pair

Molex Inc. has announced what it says is a high-density, low-profile solution that supports data rates of up to 40Gb/s per differential pair. The SpeedStack Mezzanine Connector System is geared for OEMs that struggle with limited PCB space in industries such as telecommunications, networking, military, medical electronics and consumer technology, added the company.

The mated stack heights of 4-10mm along with 0.80mm pitch claims to provide design engineers with the ultimate in flexibly to address space constraints without sacrificing performance.

The SpeedStack Connector System comes in multiple circuit sizes of 22, 44, 60, 82, 104 and 120 with a range of 6-32 differential pairs for even greater flexibility. The 100? design provides superior impedance control with an 85? version to be released in June 2013 that will support PCIe* Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for next-generation I/O and memory signalling. The insert-moulded wafer design includes a protective shrouded housing, providing support to the terminal location and improved electrical balance. A common ground pin helps improve electrical performance and minimise cross talk.