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HSAutoLink II interconnect system ready for 2.0Gbit/s

Posted: 02 Apr 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Molex? interconnect? infotainment? Ethernet? USB 3.0?

Molex Incorporated has recently rolled out its HSAutoLink II interconnect system. The company's latest product links multiple high-speed media protocols in automotive electronics. It is designed for in vehicle infotainment, telematics devices, radio and navigation systems. It also caters to intelligent assistant systems and cameras for parking, lane departure, pedestrian warning, night vision, and other collision avoidance vision systems.

Available initially in 6 and 12 circuits, the HSAutoLink II connection system is compatible with shielded twisted-pair (STP) or jacketed unshielded twisted pair (JUTP) cabling. The HSAutoLink II system supports USB 2.0, USB 3.0, LVDS, Ethernet AVB (Audio Visual Bridging), and modified HDMI, DVI and DisplayPort. The system uses a field-proven terminal interface designed for reliable, high pin-count signalling applications. Providing a continuous current capacity of 1.5Amps the terminal delivers low contact insertion force (0.5N per circuit) and can withstand up to 5,000 mating cycles with a standard gold plating finish. The unique contact geometry design promotes high bandwidth performance with a nominal data-rate measured between 3 to 4GHz in a differential signalling environment.

"Popular infotainment and safety features utilising multiple cameras with high resolution imagery are dominating modern automotive electronics and driving up bandwidth," says Mike Gardner, global marketing manager, Molex. "The HSAutoLink II delivers superior reliability, speeds exceeding 2Gbit/s data rates, and an innovative solution for managing multiple cable constructions meeting different media protocols."

Featuring a fully-protected harness connector and closed inner core shield case for superior EMI protection, the waterproof version of HSAutoLink II connector system meets protection class IP69K while the same core assembly can alternatively be packaged into a unsealed housing for size optimisation in non-waterproof applications. Molex manufacturing sites are ISO 9000 and QS 9000 certified.

Further information regarding Molex's HSAutoLink II interconnect system can be found here.

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