IME, UTAC team up for 2.5D TSI packaging solutions

A*STAR's Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC) have partnered to develop packaging solutions for volume manufacturing via IME's 2.5D Through-Silicon-Interposer (TSI) platform.

This collaboration builds on the technology expertise of both partners and leverages IME's 300mm Through-Silicon-Via (TSV)/TSI fabrication and assembly infrastructure to develop and prototype 2.5D TSI-based systems. IME will contribute its R&D experience in design and advanced packaging to develop optimised solutions to address electrical, thermal, thermo-mechanical and reliability requirements for applications including mobile devices such as tablets and smartphones. The optimised 2.5D TSI technology from this collaboration will be transferred to UTAC for high volume manufacturing.

With the 2.5D/3D IC process technologies gradually being accepted by industry, IME has been actively engaging companies from the supply chain to drive the mass production of 2.5D/3D ICs. The research institute launched its 2.5D TSI multi-project wafer (MPW) service back in December and claimed that by enabling the heterogeneous integration of different functionalities including logic, memory, analogue/RF, photonics, micro-electromechanical systems, devices with more functionality, smaller form-factor and less power consumption can be easily manufactured. (See A*STAR offers 2.5D through-silicon-interposer MPW service.)