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TSMC FinFET production set in 2013

Posted: 15 Apr 2013 ?? ?Print Version ?Bookmark and Share

Keywords:FinFET? EUV? login wafers? double immersion lithography? graph 3D transistor?

Taiwan Semiconductor Manufacturing Company Ltd has revealed its plans for its 16nm FinFET process to start production to the end of 2013 as it faces stiff competition from Globalfoundries and Samsung. The company also plans to adopt extreme ultraviolet lithography (EUV) to make 10nm chips by late 2015. However, TSMC is still looking at e-beam as a possible alternative.

Company executives detailed the new processes and how they aim to get there at an annual symposium. They also provided an update on their work on 3D chip stacks and their ongoing ramp of today's 28nm process node.

"It looks like we have another seven to eight years ahead in advances!maybe more!we can see in technology down to 10- and even 7nm," said Morris Chang, founder and chief executive of TSMC, speaking to a small group of press.

"Moore's Law is going to go on and we will be there!if anyone pursues it, we will pursue it," he told an audience of several hundred chip designers.

TSMC founder and CEO

Chang: Moore's Law is going to go on and we will be there if anyone pursues it, we will pursue it.

Chang, a veteran of more than 50 years in semiconductors, forecasts 4 per cent growth for the industry this year.

"Fabless companies probably can enjoy 9 per cent growth this year, and we are also optimistic about ourselves!we expect growth in the teens," he said.

Chang mentioned TSMC will spend more than $9 billion in capex in 2013. That's up from $2 billion in 2009.

A heady ramp for 28nm
Much of this year's growth comes in the 28nm node. Just a year ago, Qualcomm's chief executive Paul Jacobs was telling his investors the company could sell more of the advanced chips than it could make at TSMC and was searching for capacity elsewhere.

In June 2010, TSMC broke ground on a so-called Gigafab 15 site in Taichung, Taiwan, it planned as its manufacturing centre for 28nm chips. By April 2012, just 22 months later, it started production in half the planned facility!a record for the Taiwan foundry.

Within eight months it was kicking out 50,000 28nm wafers a month!another record!but it still wasn't enough. So, next month the second half of the facility is set to produce its first wafers and within five months is expected to beat the old record and add another 50,000 28-nm wafers/month. "The scale is difficult to appreciate," said Chang.

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