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Pad conditioner geared for wafer fabrication

Posted: 15 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:wafer fabrication? pad conditioner? CVD SiC?

Morgan Advanced Materials has debuted its Diamonex Phoenix Edge pad conditioner that the company said is intended for the most demanding chemical mechanical polishing (CMP) applications such as wafer fabrication at 32nm. The dimensional stability, high purity, corrosion resistance and excellent surface integrity of the firm's advanced ceramic materials ensure reliable performance in the harsh environment of the fabrication chamber, boasted the company.

Morgan revealed chemical vapor deposition silicon carbide (CVD SiC) for real time protocol and etch chambers, pyrolitic boron nitride (CVD PBN) for OLED or organic LED evaporation applications and speciality graphite components for ion implanters and OLED.

A team of experienced engineers developed the Diamonex Phoenix Edge pad conditioner. This breakthrough technology produces highly consistent fine pad texture required for the advanced process nodes, stated Morgan.

Diamonex Phoenix Edge pad conditioners claim to produce CMP pads with significantly smaller asperities and more consistent pad texture than pad conditioners using traditional diamond crystals or grit.

Because contact is made by the edges of precisely-machined elevated surfaces coated with CVD diamond, rather than diamond grit, Phoenix Edge pad conditioners provide consistent performance in all regions of the pad, throughout the long life of each conditioner, and from conditioner to conditioner.

Constructed of an engineered ceramic substrate and coated with Diamonex CVD diamond coating, the Phoenix Edge pad conditioners are an engineered solution for controlling pad texture. The edges can be arranged in spiral or concentric patterns, with specifically-engineered dimensions, to produce the required pad texture that will optimise CMP performance for each application, detailed Morgan.

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