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Molex's memory module sockets set for ultra-low power needs

Posted: 20 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Molex? DDR3? DIMM? memory module? sockets?

Molex Inc. has recently unveiled its latest portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets. Both product lines are aimed at the memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls and medical equipment.

Molex's DDR3 DIMM sockets feature a lower seating plane than standard designs, enabling the use of very low-profile modules with maximum seating heights below 2.80mm in ATCA blade systems. The new DDR3 DIMM sockets also feature low-level contact resistance of 10 milliohms to support the use of registered DIMM modules and reduce power consumption in blade servers.

The company's aerodynamic DDR3 DIMM sockets feature a streamlined housing and latch design to maximise airflow and eliminate trapped hot air during operation. The ergonomic latches enable quick actuation and easy removal of high-density memory modules. The low 2.40mm seating plane optimises vertical space for more flexible socket module design heights. Aerodynamic DDR3 DIMM sockets are available in very low profile press-fit (14.26mm), low profile press-fit (22.03mm), low profile SMT (21.34mm) and very low profile SMT (14.20mm) heights. The press-fit sockets feature smaller eye-of-needle compliant pins than standard press-fit terminals to free up valuable PCB real estate for higher-density trace routing. All Molex aerodynamic DDR3 DIMM sockets are RoHS compliant and SMT versions are halogen-free.

Molex ultra-low profile DDR3 DIMM sockets feature a seating plane of 1.10mm. The sockets provide up to 20.23mm of vertical space above the PCB for mounting high-density DIMMs and are ideal for applications requiring conformance to ATCA Board Mechanics Specifications where component heights cannot exceed 21.33mm from side one of the front board PCB.

Ultra-low profile DDR3 DIMM sockets also feature reduced latch-actuation angles, which use less PCB real estate than standard DIMM sockets to improve airflow and enable more adjacent components. The new halogen-free sockets have a glass-filled, high-temperature nylon housing and latches to enable wave soldering and high-temperature infrared reflow operations.

Further information regarding Molex's aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets can be found here.





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