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U-blox teams with Intel for dedicated HSPA module

Posted: 20 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:U-blox? HSPA? module? Intel? 3G?

U-blox has recently announced team up with Intel Corporation that aims to bring a small, cost-effective 3G only HSPA module to market.

Based on Intel's XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with U-blox' SARA 2G and LISA 3G module series. U-blox 2G-3G-4G nested design allows product designers to tailor their solutions to target markets based on a single PCB design, facilitating product diversity and easy migration.

"The XMM 6255 platform is latest innovation by Intel and specifically designed for M2M," said Horst Pratsch, head of product line modules and M2M at Intel Corporation. "Integrating the 3G power amplifier in the transceiver delivers the smallest possible size and lowest number of components enabling new applications of 3G in machine-to-machine applications," added Pratsch.

Based on Intel X-GOLD 625 digital- and analogue-base band with integrated Power Management Unit and the Intel SMARTi UE2p transceiver for 3G, the Intel XMM 6255 platform is the smallest available HSPA modem chipset. Its compact size and powerful HSPA performance enables U-blox to create the world's smallest dedicated 3G modem module dedicated to operation over 3G networks worldwide.

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