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Protect USB 2.0 interfaces against ESD

Posted: 29 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Integrated Circuit? electroStatic discharge? Zener diodes?

An integrated circuit (IC) connected to external ports can be damaged by electrostatic discharge (ESD) from the operating environment.

The result of ever-shrinking IC process technology is the decrease of ESD robustness because of the smaller geometry of the silicon die.

Traditional methods to prevent ICs from ESD damage are the implementation of additional devices such as:

???Zener diodes
???Varistors
???Transient Voltage Suppressor (TVS) diodes
???Bipolar clamp diodes
However, at much higher data rates, the parasitic characteristics can distort or deteriorate signal integrity. This application note examines the general parameters the hardware designer should look at to increase the ESD robustness of the application, e.g.USB interfaces.

View the PDF document for more information.

Originally published by NXP Semiconductors at www.nxp.com as "ESD protection for USB 2.0 interfaces".





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