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Imec, Globalfoundries team up for high-density memory

Posted: 22 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:high-density memory? SRAM? DRAM? STT-MRAM?

Imec and Globalfoundries have expanded their collaboration to advance spin-transfer torque magnetoresistive random access memory (STT-MRAM) technology. According to them, STT-MRAM technology is a promising high-density alternative to existing memory technologies such as SRAM and DRAM. Along with other programme members, they aim to explore the potential of STT-MRAM, including performance below 1ns and scalability beyond 10nm for embedded and stand-alone applications.

"We are elated to intensify our collaboration with Globalfoundries and the other programme members on advanced memory technologies-it's a true testament to the value we offer our industrial partners," stated Luc Van den hove, president and CEO at Imec. "Our unique research environment harnesses the collective expertise and knowledge of the entire value chain, bringing together foundries, IDMs, fabless and fablite companies, packaging and assembly companies, and equipment and material suppliers to drive innovation and the development of new, competitive products."

"Innovation in next-generation memory is required to give chip designers new options to continue to deliver leading-edge products with higher performance, lower power-consumption and better bandwidth," said Globalfoundries chief technology officer Gregg Bartlett. "This new partnership with Imec will enable close collaboration with customers, partners, and the supplier community to help reduce the risk in bringing this new memory technology to market."

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