Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Collaboration to yield low cost interposers for 2.5D ICs

Posted: 30 May 2013 ?? ?Print Version ?Bookmark and Share

Keywords:LCI? 2.5D IC? 3D IC?

Singapore's A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc. and STATS ChipPAC have joined forces to develop technology building blocks for low cost interposers (LCI) for 2.5D ICs.

"2.5D/3D IC technology provides ample opportunities to further increase functionality and performance of semiconductor ICs. A collaborative approach is necessary for the industry to harness 2.5D/3D IC technologies successfully," noted Dim-Lee Kwong, executive director of IME. "IME's consortium with Qualcomm Technologies and STATS ChipPAC focuses on pushing forward cost-effective manufacturing approaches in a timely manner."

"This initiative extends our R&D efforts in the 2.5D/3D technologies and is another example of our investment in the silicon technology space," said Jim Lederer, EVP and GM, Qualcomm Technologies. "The collaboration with IME and STATS ChipPAC will help us support the ability to optimise 2.5D/3D IC technology and achieve cost and performance needs."

"We are pleased to be part of this consortium to develop 2.5D technology solutions to address issues related to high volume manufacturing of 2.5D interposers," indicated Han Byung Joon, EVP and CTO, STATS ChipPAC. "This collaboration, in conjunction with STATS ChipPAC's proven expertise in manufacturing 2.5D/3D ICs, expands our strategic relationship with Qualcomm Technologies and IME."





Article Comments - Collaboration to yield low cost inte...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top