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Si2 set to unveil PDN Standard for 3D integrated ICs

Posted: 03 Jun 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Silicon Integration Initiative? Apache? PDN? 3D design?

The Silicon Integration Initiative (Si2) recently released a Power Distribution Network Standard for 3D Integrated Circuits (IC) under the guidance of the Open 3D Technical Advisory Board. (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows. Contributing to the standard was Apache, a subsidiary of ANSYS Corporation.

"The PDN standard effort began with 11 industry members and an initial spec contribution from Apache," said Norman Chang, Vice President and Senior Product Strategist at Apache Design, a subsidiary of ANSYS. "So it is rewarding to now see the first Si2 Open3D PDN standard become a reality in assisting power/signal integrity checking for 3D-IC design with dies from multiple technologies and vendors."

The 3D-IC Design Exchange Format Standard for Power Distribution Networks (PDN) describes a unified interface protocol for both Power/Ground and signal ports for die-2-die, die-2-package and package-2-PCB interfaces. This also allows the creation of compact SPICE-level descriptions to aid in the design, analysis and optimisation of the resulting networks that define these interfaces to ensure they meet the requirements for power and signal integrity.

"2.5D and 3D integration have been identified as the means to stretch semiconductor technology into the "More than Moore" regime," says Sumit DasGupta, Sr. Vice President, Engineering, Si2. "Open standards to enable best-in-class design flows and tools are essential to ensure that this nascent technology delivers on its promise."

The standard is available for download here.

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