Molex rolls out 10 port RF DIN modular backplane system

Molex has rolled out a connector system designed specifically to enable PCB developers in telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints. The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility.

The modular board-to-board system offers multiple options including a standard four port, 75Ohm contact version or customisable six, eight and 10 ports with 50Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs. The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3GHz frequency applications making it ideal for CATV, communication systems and high-density radio applications. The connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing.