Spin coatable negative I-Line photoresist for MEMS

Engineered Material Systems, a negative photoresist material supplier for MEMS and IC cooling applications, recently introduced NR-2500 Liquid Negative Photoresist for use in MEMS. The material formulation has been optimised for spin coating and processing on MEMS and IC wafers.

The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The NR-2500 photoresist is tougher and less brittle than other negative photoresists in the market with a glass transition temperature of 165°C and a moderate modulus of 4.5GPa at 25°C. The cured chemistry is hydrophobic in nature providing for chemical and moisture resistance. The NR series is available in various solids/viscosities that can achieve from 2-40?m thickness in a single layer.

NR-2500 photoresist is compatible with the EMS line of dry-film photoresists. NR-2500 liquid photoresist is the latest addition to the company's full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.

More information about the new NR-2500 Liquid Negative Photoresist can be found here.