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A*STAR IME, IC firms team up to tackle industry issues

Posted: 25 Jun 2013 ?? ?Print Version ?Bookmark and Share

Keywords:2.5D Through-Silicon Interposer Consortium? TSI? consumer electronics?

A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to speed up market adoption of TSI technology, which is driven by strong demands in computer infrastructure and consumer electronics. The members of the consortium include manufacturing firms such as eSilicon, EV Group (EVG), KMG Ultra Pure Chemicals, Synopsys International, Tezzaron Semiconductor, United Microelectronics Corp. (Singapore Branch) and United Test and Assembly Centre (UTAC).

The consortium aims to deliver a high-performance functional 2.5D IC test vehicle to demonstrate and optimise integration of logic and 3D memory, integrated passive devices (IPD) and dense interconnects on TSI. It targets low power and high performance requirements of networking, graphics and mobile application processors. At the same time, the fabrication and assembly of the interposers on 300mm wafers will support volume production at low cost.

The consortium brings members of the supply chain together to address challenges such as heat management, reliability analysis and packaging. IME will provide its onsite 300mm wafer fabrication resources and assembly process capability while consortium members will bring their market expertise on performance, design and manufacturing requirements.

Heterogeneous integration on silicon interposers provides a viable solution to the demand in the computer and consumer electronics markets for higher processing speed, lower power and increased functionalities. Yole Dveloppement analysts expect that over two million 300mm wafers will be produced in 2017 and the 2.5D interposer substrate will impact more than 16 per cent of the traditionally 'organic-made' IC package substrate business by 2017, with almost $1.6 billion revenues generated by then. Notwithstanding the expected ramp-up, the infrastructure for 2.5D/3D interposers on 300mm today remains weak. By addressing the 2.5D IC manufacturing and cost challenges using 300mm wafer fabrication, IME believes that the execution of the project will bring considerable value to the semiconductor manufacturing ecosystem.

"Continued development and optimisation of through-silicon interposer technology is a necessary next step in the semiconductor industry in order to generate market growth for 2.5D ICs," said Dim-Lee Kwong, executive director of A*STAR IME. "The strategic alliance between fabless companies, technology and EDA providers, foundry, assembly and test providers, materials and equipment vendors, in which each represents a vital segment of the manufacturing ecosystem, will advance the market adoption of 2.5D integration for a wide range of applications."

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