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SPTS purchases Xactix to expand etch sol'ns

Posted: 27 Jun 2013 ?? ?Print Version ?Bookmark and Share

Keywords:silicon/molybdenum/germanium? silicon oxide? xenon difluoride? etch?

SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, has acquired Xactix Inc., a provider of xenon difluoride (XeF2)-based release etch technology. By adding the Xactix product line to its HF vapor phase release offering, SPTS now supports release technologies for silicon/molybdenum/germanium and silicon oxide sacrificial layers. According to the company, both processes offer advantages over traditional wet etch solutions because they eliminate "stiction" between moving parts that can make precision MEMS devices inoperable.

SPTS and Xactix jointly developed the CVE single wafer XeF2 release etch module and have shared sales/marketing channels over a number of years.

"Bringing Xactix's technology and product portfolio into the SPTS family is a natural and logical step for us." said William Johnson, president and CEO at SPTS. "This expands our product offering in MEMS release etch and adds to our MEMS tool-box."

Kyle Lebouitz, CTO and founder of Xactix echoed these sentiments, "This evolution of the long-standing relationship between SPTS and Xactix will expand our opportunities in the MEMS market, and provide our customers with an enlarged and comprehensive sales and support infrastructure."

Xactix operations and personnel will now become part of SPTS' Release Etch Division, also based in Pennsylvania.





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