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EVG unveils room-temperature debonding platform

Posted: 03 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:EV Group? Wafer bonding? debonding? semiconductor? packaging?

Wafer bonding and lithography equipment supplier EV Group (EVG)recently rolled out its LowTemp debonding platform. The company's latest platform features three different room-temperature wafer-debonding processes and an extended material supply chain.

The platform includes two new debonding processes that have been qualified for EVG's high-volume production temporary bonding/debonding (TB/DB) systems in addition to EVG's ZoneBOND technology, which has already been implemented into production across the compound semiconductor and advanced packaging markets. EVG's LowTemp debonding platform is complemented by a supply chain of seven material suppliers, with a wide choice of qualified adhesives that support a variety of bonding applications and offer greater process flexibility.

platform

Figure: The LowTemp room-temperature debonding platform is available on EVG's temporary bonding/debonding systems, including the EVG850TB/DB XT Frame platform. Source: EV Group.

The company's LowTemp debonding platform adds to their comprehensive portfolio of temporary bonding/debonding and thin-wafer handling solutions based on tape debonding and thermal slide-off debonding technology. The LowTemp debonding platform is available on EVG's full line-up of TB/DB systems, including the recently announced EVG850TB/DB XT Frame high-volume production platform, which can achieve a throughput of more than 40 wafer stacks per hour and features an optional, integrated in-line metrology module that takes up to 300,000 measurement points at unprecedented speeds to enable real-time monitoring of the bonding/debonding process for maximum yields.





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