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USHIO books its interposer stepper for 2.5D/3D packaging

Posted: 09 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:USHIO? manufacturing interposers? advanced-packaging?

USHIO Inc. has booked the large-field stepper "UX7-3Di LIS 350" for manufacturing interposers used for 2.5D/3D packaging applications. The company will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

"For high-volume production of 2.5D/3D interposers, we have introduced a stepper capable of processing not only Si wafers but also square substrates including glass and organic substrates. Utilising this UX7-3Di LIS 350 stepper allows significant reduction of the interposer manufacturing cost, which ultimately leads to reduction of the manufacturing cost of final products such as smart phones and tablet PCs," commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC.

The UX7-3Di LIS 350, the latest model of the UX7-3Di interposer stepper series, has achieved a resolution of 2?m L/S on a 300mm Si wafer as well as an organic substrate. Mounted with a proprietary alignment mechanism, the UX7-3Di LIS 350 is able to address a warp or expansion/contraction of an organic substrate, thus being optimised for manufacturing 2.5D/3D interposers made of organic substrates that have recently become popular, other than Si wafers.

In order to meet the further need for finer circuit patterns, USHIO is currently developing a large-field precision projection lens that can produce a super-high resolution of 1?m L/S.

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