Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Palomar set to debut latest die bonder tech at SEMICON West

Posted: 10 Jul 2013 ?? ?Print Version ?Bookmark and Share

Keywords:Palomar Technologies? wire bonder? Radar?

Palomar Technologies will launch the 8000i Wire Bonder with Intelligent Interactive Graphical Interface (i2Gi) and VisionPilot for automated high-precision die attach at SEMICON West 2013.

i2Gi is an new feature on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. The new feature offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. It enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation.

The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customised looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. The 8000i Wire Bonder is versatile, powerful and can provide specialised functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.

The company also revealed details regarding its VisionPilot technology. The software utilises advanced geometric pattern matching technology to reliably and accurately locate parts. Combined with Radar Referencing, the software solves the most demanding die finding scenarios. Built upon Cognex PatMax, Radar Referencing uses a set of boundary curves that are not tied to a pixel grid and then looks for similar shapes in the image without relying on specific grey levels. The result is an improvement in the ability to accurately find objects despite changes in angle, size, and shading.

VisionPilot is easy to incorporate into new or existing programs. The existing programs can remain the same and an additional Radar Referencing location can be added to an existing type. Programming Radar Referencing is very similar to programming auto correlation. The images are taught the same way as auto correlation with some slight changes in the parameter settings.

Further information regarding Palomar Technologies latest products can be found below:

  • 8000i Wire Bonder with Intelligent Interactive Graphical Interface (i2Gi)
  • VisionPilot for automated high-precision die attach

  • Article Comments - Palomar set to debut latest die bond...
    *? You can enter [0] more charecters.
    *Verify code:


    Visit Asia Webinars to learn about the latest in technology and get practical design tips.

    Back to Top